BGA Reballing Kit 130pcs | Universal Steel Stencils for Laptop/Desktop/Graphics Card | Heat - Sturdy Template Set with 6 Sizes | 0.35mm - 0.76mm Solder Ball Mesh

Produktbeschreibung

Top-grade Stainless Steel Construction - These BGA stencils maintain ideal thickness under heat, withstanding deformation even at 300°C for accurate solder ball placement during rework. Complete 6-Size Solution - 130pcs reballing kit covers all standard BGA chips from 0.35mm to 0.76mm, reducing the need for multiple purchases with labeled sizes for quick identification. Direct-Heat Ready Design - Expert stencils work seamlessly with hot airflow devices, cutting reballing time by 40% compared to conventional templates for laptops and GPUs. Multi-Platform Compatibility - Specially engineered for north/south bridge chips, communication boards and graphics cards with 35pcs of most-used 0.5mm stencils included. 268g Robust Set - Industrial-grade steel mesh ensures 500+ reuse sessions, backed by 9.5oz weight that prevents shifting during delicate BGA rework procedures.